قوانین و کلیرنس ها

FR4(1-layer): 606 × 510 mm

FR4(2-layer): 670 × 600 mm

FR4(4-layer): 663 × 593 mm

FR4(6-layer and above): 656 × 586 mm

Rogers / PTFE Teflon PCB: 590 × 438 mm

Aluminum PCB: 602 × 506 mm

Copper PCB: 480 × 286 mm

These limits apply to PCBs with thickness ≥ 0.8 mm. The thinner FR4 PCBs are 599 × 497 mm maximum. 2-layer FR4 PCBs can reach a maximum size of 1020 × 600 mm. 4-layer FR4 PCBs can reach a maximum size of 1016 × 596 mm.

FR4/Rogers/PTFE: 3 × 3 mm Castellated / Plated Edges: 10 × 10 mm Aluminum/Copper PCB: 5 × 5 mm

These limits apply to PCBs with thickness ≥ 0.6 mm. Manual review required for thinner PCBs. Panelization is recommended for small-sized boards.

±0.1mm(Precision) and ±0.2mm(Regular) for CNC routing, and ±0.4mm for V-scoring

Thickness for FR4 are: 0.4/0.6/0.8/1.0/1.2/1.6/2.0 mm (2.5 mm and above are for 12+ layer PCBs only)

Thickness Tolerance

(Thickness≥1.0mm)

e.g. For the 1.6mm board thickness, the finished board thickness ranges from 1.44mm(T-1.6×10%) to 1.76mm(T+1.6×10%)

Thickness Tolerance

(Thickness<1.0mm)

e.g. For the 0.8mm board thickness, the finished board thickness ranges from 0.7mm(T-0.1) to 0.9mm(T+0.1).

2-layer: 1 oz / 2 oz / 2.5 oz / 3.5 oz / 4.5oz

Multi-layer: 1 oz / 2 oz

FR4 has all three finishes available, 6+ layers and RF boards only have ENIG. Aluminium core boards only have HASL. Copper core boards only have OSP.

1-layer: 0.3 – 6.3 mm

2-layer: 0.15 – 6.3 mm

Multilayer: 0.15 – 6.3 mm

Holes with diameter ≥ 6.3 mm are CNC routed from a smaller drilled hole.

Min. drill diameter for 2- or more-layer PCBs is 0.15 mm (more costly!)

Min. drill diameter for aluminum-core PCBs is 0.65 mm

Min. drill diameter for copper-core PCBs is 1.0 mm

Through-holes: +0.13 / -0.08 mm Press-fit holes：±0.05 mm (Finished hole size: 0.55-1.025mm. Multilayer ENIG boards only. Mention the specific holes in PCB Remark)

1-layer (NPTH only): 0.3 mm hole size / 0.5 mm via diameter 2-layer: 0.15mm hole size / 0.25mm via diameter Multilayer: 0.15 mm hole size / 0.25 mm via diameter ① Via diameter should be 0.1mm(0.15mm preferred) larger than Via hole size. ② Preferred Min. Via hole size: 0.2mm ③ 0.15mm hole size with any size via diameter, and 0.2mm or 0.25mm hole size with via diameter less than 0.45mm, will cost more. Please select corresponding via size option when placing order.

The minimum plated slot width is 0.5mm, which is drawn with a pad.

The length of the slot should be at least 2 times of the width.

Castellated holes are metalized half-holes on PCB edges, commonly used on daughter boards to be soldered onto carrier PCBs.

① Hole diameter (Φ): ≥ 0.5 mm

② Hole to board edge (L): ≥ 1 mm

③ Hole to hole (D): ≥ 0.5 mm

④ Min. PCB size：10 × 10 mm

⑤ Min. PCB thickness: 0.6 mm

Plated edges are copper-plated and ENIG treated. HASL is not supported.

① Min. PCB size: 10 × 10 mm

② Min. PCB thickness: 0.6 mm

③ At least 3 breaks (more for larger PCBs) in the edge plating are required for support tab connections

edge plating are required for support tab connections

① Blind slot width (W): ≥1.0mm

② Blind slot depth (D): ≥0.2mm

③ Blind slot annular width (A): ≥0.3mm (The pad width of PTH blind slots)

④ Safety distance (S): ≥0.2mm (The distance from NPTH blind slots to pad/traces/copper plane)

⑤ Blind slot remaining thickness (R): ≥0.2mm (The distance from the bottom of the blind slot to the nearest inner copper layer/surface substrate)

⑥ Supports 2-32-layer FR4 boards with a thickness of ≥0.8mm

Backdrill uses a secondary drilling process to control the depth of the hole, removing excess copper from the other layers of the via, thereby reducing its interference with the signal.

①Supports 4-32-layer FR4 boards with a thickness of ≥0.8mm

②Through-Hole Diaemter(D): 0.2-0.5mm(Epoxy filled after backdrilling)

③Backdrill Diameter(W): typically 0.2mm larger than through-hole diameter

④Backdrill Depth(L):layers with backdrilling, customizable

⑤Dielectric Thickness(T): ≥0.15mm(from bottom of backdrill to the adjacent inner copper layer)

⑥Safety Distance(S): ≥0.2mm(edge to pad/trace/copper safety distance)

2-layer:

1 oz: Recommended 0.25 mm or above; absolute minimum 0.18 mm

2 oz: 0.254 mm or above

Multilayer:

1 oz: Recommended 0.20 mm or above; absolute minimum 0.15 mm

2 oz: 0.254 mm or above

Recommended 0.45 mm or more. This is to allow a 0.2 mm ring of copper to be removed around the hole for the sealing film to attach. Pad sizes smaller than the recommended value can result in the annular ring being very thin or completely missing.

① 0.2mm-0.25mm BGA pad diameter requires ENIG

② BGA pad to trace clearance ≥ 0.1 mm (min. 0.09 mm for multilayer boards)

③ Vias can be placed within BGA pads using filled and plated-over vias

Minimum trace width/clearance: 0.15/0.15mm, when traces are covered by solder mask (1oz).

Minimum trace width/clearance: 0.25/0.25mm, when traces are NOT covered by solder mask (1oz). ENIG only(high risk of short circuit with HASL)

LDI equipment upgraded in June 2025. Pad size:soldermask opening can be 1:1(Previous production file will be followed in Reorder).

Keep at least 0.09 mm clearance between soldermask openings and neighboring traces.

1oz:

Min. pad spacing: 0.10 mm (green, red, yellow, blue, purple)

Min. pad spacing: 0.13 mm (black, white)

2oz:

Min. pad spacing: 0.20 mm (any color)

Vias are filled with soldermask for an opaque finish. Click for detailed explanation

① Filled vias must not have soldermask openings on either side

② Filled vias should have ≥ 0.35 mm clearance from other soldermask openings (e.g. pads)

③ Filled vias must be no wider than 0.5 mm diameter

Epoxy Filled & Capped

Copper paste Filled&Capped

Vias are filled with epoxy resin or copper paste and then plated over to achieve an opaque and smooth finish. Click for detailed explanation

① Vias are filled and plated over. Choose copper paste filling for applications requiring high thermal conductivity.

② This process is the default for 6-layer and above multilayer boards.

③ Compatible with via diameters from 0.15 to 0.55 mm.

① Copper clearance from routed board edges: ≧0.2 mm

② Copper clearance from routed slots: ≧0.2 mm

③ Dimension tolerance for routed board edges: ±0.2 mm (regular precision); ±0.1 mm (high precision)

④ Minimum dimension 50*50mm for high precision, and at least 3 tooling holes with minimum 1.5mm diameter on different corners.

⑤ Minimum slot width for aluminum/copper core PCB: 1.6mm.

① Copper clearance from V-cut board edges: ≧0.4 mm

② Dimension tolerance for V-cut board edges: ±0.4 mm. PCB thickness ≥ 0.6 mm

③ Zero panel board spacing by default. Alternatively, V-cut along one direction with no spacing and route along the other direction with 1.6 or 2 mm board spacing.

④ Min. panel dimensions: 70 × 70 mm; max. panel dimensions: 475 × 475 mm

⑤ V-cut groove angle: 25°

⑥Minimum spacing between two v-cuts: 2mm(3mm is recommended)

① Copper clearance from non-mouse-bite board edges: ≧0.2 mm

② Dimension tolerance for non-mouse-bite board edges: ±0.2 mm (regular precision); ±0.1 mm (high precision)

③ Panel board spacing: 1.6 or 2 mm

④ Serrated edges will remain after depanelization

⑤ Minimum tooling edge width: 3 mm. For SMT assembly at JLCPCB, use 5 mm tooling edges, 2 mm tooling holes, and 1 mm fiducials centered at 3.85 mm from the panel edges.

⑥ Recommended diameter of mouse bite is 0.5mm-0.8mm; Recommended distance between the two mouse-bites is 0.2-0.3mm. The minimum width of breakaway tab is 4mm. For breakaway with mouse-bites, the minimum width is 5mm.

The single round board size should be≥20mmx20mm when choose panel by JLCPCB.

Panelize with stamp holes and add tooling strips on four board edges

The single round board size should be≥20mmx20mm when choose panel by JLCPCB.

Panelize with stamp holes and add tooling strips on four board edges